[ Pobierz całość w formacie PDF ]
the downstream end.
time of successive solder waves must not exceed
During placement and before soldering, the package must
5 seconds.
be fixed with a droplet of adhesive. The adhesive can be
The device may be mounted up to the seating plane, but
applied by screen printing, pin transfer or syringe
the temperature of the plastic body must not exceed the
dispensing. The package can be soldered after the
specified maximum storage temperature (Tstg max). If the
adhesive is cured.
printed-circuit board has been pre-heated, forced cooling
Maximum permissible solder temperature is 260 °C, and
may be necessary immediately after soldering to keep the
maximum duration of package immersion in solder is
temperature within the permissible limit.
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
Apply a low voltage soldering iron (less than 24 V) to the
of corrosive residues in most applications.
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
REPAIRING SOLDERED JOINTS
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
Fix the component by first soldering two diagonally-
between 300 and 400 °C, contact may be up to 5 seconds.
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
SO
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
REFLOW SOLDERING
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO
270 and 320 °C.
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
July 1994 22
Philips Semiconductors Preliminary specification
VIF-PLL demodulator and FM-PLL detector TDA9800
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994 23
[ Pobierz całość w formacie PDF ]